Use of latest model HP pump, HDP.
Complete 316 SSL block-style/NAB manifolds for strength and corrosion resistance.
Built-in cooling system allow liquid to cool high pressure packing seals preventing higher temperatures built up during long running hours.
Longer seal life & long term cost saving.
Pump can be upgrade from 300 bars to 1200 bars by upgrading kits. No change in motor & frame. 30 min conversion time for trained technician.
Rollers & Nozzles manifolds for system
Rollers & nozzles manifolds from 25mm to 110mm width products, suitable for all type of packages. Able to built with grooves for small leads package which avoid chipping. Special alloy roller upon request.
Special design nozzles manifolds for smaller & precise packages deflashing. Quick change over & able to use with compact version nozzles.
GSS nozzles
GSS nozzle is specially design to use in semiconductor deflashing. It has a compact body where it fits in a small product deflashing. Whereas, others’ made deflashing nozzles are much bigger, thus requiring a bigger pitching to fit in between 2 nozzles. General fanjet found in market are normally big in size and don’t come handy. They are fast wearing and requires bigger or more nozzle manifolds to deflash 1 product.
GSS deflashing nozzles are sealess between nozzle’s tip & housing. Unlike tradition nozzles, seal is require and often wear after some running hrs. This result pressure lost at nozzle & reduce impact on product’s surface.
GSS deflashing nozzle are made from super harden material & with special coating surface. Its new flow channel allow no pressure lost & able to withstand higher pressure & last long running hrs.
Before and After Cleaning results
Different Types of Semi-Conductor Products
Different products require different pressure & nozzle type.
Different type of deflashing;
General deflashing and Precise deflashing